Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints HW Yang, JY Wu, ZX Zhu, CR Kao Materials Chemistry and Physics 191, 13-19, 2017 | 22 | 2017 |
Low‐Cost Sensor‐Rich Fluidic Elastomer Actuators Embedded with Paper Electronics TH Yang, J Shintake, R Kanno, CR Kao, J Mizuno Advanced Intelligent Systems 2 (8), 2000025, 2020 | 19 | 2020 |
Fast atom beam-and vacuum-ultraviolet-activated sites for low-temperature hybrid integration HW Yang, CR Kao, A Shigetou Langmuir 33 (34), 8413-8419, 2017 | 15 | 2017 |
Effects of aspect ratio on microstructural evolution of Ni/Sn/Ni microjoints TH Yang, HY Yu, YW Wang, CR Kao Journal of Electronic Materials 48, 9-16, 2019 | 14 | 2019 |
Monolithic 3D integration of back-end compatible 2D material FET on Si FinFET SX Guan, TH Yang, CH Yang, CJ Hong, BW Liang, KB Simbulan, ... npj 2D Materials and Applications 7 (1), 9, 2023 | 12 | 2023 |
Organic-inorganic solid-state hybridization with high-strength and anti-hydrolysis interface TH Yang, CR Kao, A Shigetou Scientific Reports 9 (1), 504, 2019 | 10 | 2019 |
Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation JJ Yu, JY Wu, LJ Yu, HW Yang, CR Kao Journal of Materials Science 52, 7166-7174, 2017 | 10 | 2017 |
Surface diffusion and the interfacial reaction in Cu/Sn/Ni micro-pillars HY Yu, TH Yang, YS Chiu, CR Kao Journal of Electronic Materials 49, 88-95, 2020 | 8 | 2020 |
Foldable Kirigami paper electronics TH Yang, H Hida, D Ichige, J Mizuno, C Robert Kao, J Shintake physica status solidi (a) 217 (9), 1900891, 2020 | 7 | 2020 |
Ferroelectric transistors based on shear-transformation-mediated rhombohedral-stacked molybdenum disulfide TH Yang, BW Liang, HC Hu, FX Chen, SZ Ho, WH Chang, L Yang, HC Lo, ... Nature Electronics 7 (1), 29-38, 2024 | 5 | 2024 |
Sub-bandgap photoluminescence properties of multilayer h-BN-on-sapphire S Saha, YC Chang, TH Yang, A Rice, A Ghosh, W You, M Crawford, ... Nanotechnology 33 (21), 215702, 2022 | 5 | 2022 |
Room temperature negative differential resistance in clay-graphite paper transistors ST Yang, TH Yang, CI Lu, WH Chang, KB Simbulan, YW Lan Carbon 176, 440-445, 2021 | 5 | 2021 |
Critical factors affecting structural transformations in 3D IC micro joints HW Yang, HY Yu, CR Kao 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1008-1013, 2017 | 5 | 2017 |
Polyimide-polyetheretherketone and tin-polyimide direct bonding via ethanol-assisted vacuum ultraviolet irradiation TH Yang, YS Chiu, CY Yang, A Shigetou, CR Kao Transactions of The Japan Institute of Electronics Packaging 12, E19-012-1 …, 2019 | 4 | 2019 |
Twisted Light-Induced Photocurrent in a Silicon Nanowire Field-Effect Transistor YJ Feng, KB Simbulan, TH Yang, YR Chen, KS Li, CJ Chu, TH Lu, ... ACS nano 16 (6), 9297-9303, 2022 | 3 | 2022 |
Defect-engineered room temperature negative differential resistance in monolayer MoS 2 transistors WH Chang, CI Lu, TH Yang, ST Yang, KB Simbulan, CP Lin, SH Hsieh, ... Nanoscale Horizons 7 (12), 1533-1539, 2022 | 3 | 2022 |
A single process for homogeneous and heterogeneous bonding in flexible electronics: Ethanol-assisted vacuum ultraviolet (E-VUV) irradiation process TH Yang, CY Yang, A Shigetou, CR Kao 2019 International Conference on Electronics Packaging (ICEP), 117-122, 2019 | 3 | 2019 |
Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation TH Yang, CR Kao, A Shigetou 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 3 | 2018 |
Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique CC Li, SJ Hsu, CC Lee, LL Liao, MJ Dai, CK Liu, ZX Zhu, HW Yang, JH Ke, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1470-1476, 2015 | 3 | 2015 |
Morphological evolution induced by volume shrinkage in micro joints HW Yang, CR Kao 2016 International Conference on Electronics Packaging (ICEP), 286-289, 2016 | 2 | 2016 |