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Tilo H. Yang
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Ferroelectric transistors based on shear-transformation-mediated rhombohedral-stacked molybdenum disulfide
TH Yang, BW Liang, HC Hu, FX Chen, SZ Ho, WH Chang, L Yang, HC Lo, ...
Nature Electronics 7 (1), 29-38, 2024
272024
Monolithic 3D integration of back-end compatible 2D material FET on Si FinFET
SX Guan, TH Yang, CH Yang, CJ Hong, BW Liang, KB Simbulan, ...
npj 2D Materials and Applications 7 (1), 9, 2023
232023
Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints
HW Yang, JY Wu, ZX Zhu, CR Kao
Materials Chemistry and Physics 191, 13-19, 2017
222017
Low‐Cost Sensor‐Rich Fluidic Elastomer Actuators Embedded with Paper Electronics
TH Yang, J Shintake, R Kanno, CR Kao, J Mizuno
Advanced Intelligent Systems 2 (8), 2000025, 2020
202020
Fast atom beam-and vacuum-ultraviolet-activated sites for low-temperature hybrid integration
HW Yang, CR Kao, A Shigetou
Langmuir 33 (34), 8413-8419, 2017
152017
Effects of aspect ratio on microstructural evolution of Ni/Sn/Ni microjoints
TH Yang, HY Yu, YW Wang, CR Kao
Journal of Electronic Materials 48, 9-16, 2019
142019
Surface diffusion and the interfacial reaction in Cu/Sn/Ni micro-pillars
HY Yu, TH Yang, YS Chiu, CR Kao
Journal of Electronic Materials 49, 88-95, 2020
122020
Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation
JJ Yu, JY Wu, LJ Yu, HW Yang, CR Kao
Journal of Materials Science 52, 7166-7174, 2017
112017
Organic-inorganic solid-state hybridization with high-strength and anti-hydrolysis interface
TH Yang, CR Kao, A Shigetou
Scientific Reports 9 (1), 504, 2019
102019
Self-powered broadband photodetection enabled by facile CVD-grown MoS 2/GaN heterostructures
BW Liang, WH Chang, CS Huang, YJ Huang, JH Chen, KS Li, ...
Nanoscale 15 (45), 18233-18240, 2023
82023
Foldable kirigami paper electronics
TH Yang, H Hida, D Ichige, J Mizuno, C Robert Kao, J Shintake
physica status solidi (a) 217 (9), 1900891, 2020
82020
Defect-engineered room temperature negative differential resistance in monolayer MoS 2 transistors
WH Chang, CI Lu, TH Yang, ST Yang, KB Simbulan, CP Lin, SH Hsieh, ...
Nanoscale Horizons 7 (12), 1533-1539, 2022
72022
Sub-bandgap photoluminescence properties of multilayer h-BN-on-sapphire
S Saha, YC Chang, TH Yang, A Rice, A Ghosh, W You, M Crawford, ...
Nanotechnology 33 (21), 215702, 2022
52022
Room temperature negative differential resistance in clay-graphite paper transistors
ST Yang, TH Yang, CI Lu, WH Chang, KB Simbulan, YW Lan
Carbon 176, 440-445, 2021
52021
Critical factors affecting structural transformations in 3D IC micro joints
HW Yang, HY Yu, CR Kao
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1008-1013, 2017
52017
Polyimide-polyetheretherketone and tin-polyimide direct bonding via ethanol-assisted vacuum ultraviolet irradiation
TH Yang, YS Chiu, CY Yang, A Shigetou, CR Kao
Transactions of The Japan Institute of Electronics Packaging 12, E19-012-1 …, 2019
42019
A single process for homogeneous and heterogeneous bonding in flexible electronics: Ethanol-assisted vacuum ultraviolet (E-VUV) irradiation process
TH Yang, CY Yang, A Shigetou, CR Kao
2019 International Conference on Electronics Packaging (ICEP), 117-122, 2019
32019
Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation
TH Yang, CR Kao, A Shigetou
2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018
32018
Morphological evolution induced by volume shrinkage in micro joints
HW Yang, CR Kao
2016 International Conference on Electronics Packaging (ICEP), 286-289, 2016
32016
Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique
CC Li, SJ Hsu, CC Lee, LL Liao, MJ Dai, CK Liu, ZX Zhu, HW Yang, JH Ke, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1470-1476, 2015
32015
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