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Tilo H. Yang
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Ferroelectric transistors based on shear-transformation-mediated rhombohedral-stacked molybdenum disulfide
TH Yang, BW Liang, HC Hu, FX Chen, SZ Ho, WH Chang, L Yang, HC Lo, ...
Nature Electronics 7 (1), 29-38, 2024
552024
Monolithic 3D integration of back-end compatible 2D material FET on Si FinFET
SX Guan, TH Yang, CH Yang, CJ Hong, BW Liang, KB Simbulan, ...
npj 2D Materials and Applications 7 (1), 9, 2023
32*2023
Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints
HW Yang, JY Wu, ZX Zhu, CR Kao
Materials Chemistry and Physics 191, 13-19, 2017
242017
Low‐Cost Sensor‐Rich Fluidic Elastomer Actuators Embedded with Paper Electronics
TH Yang, J Shintake, R Kanno, CR Kao, J Mizuno
Advanced Intelligent Systems 2 (8), 2000025, 2020
232020
Fast atom beam-and vacuum-ultraviolet-activated sites for low-temperature hybrid integration
HW Yang, CR Kao, A Shigetou
Langmuir 33 (34), 8413-8419, 2017
162017
Surface diffusion and the interfacial reaction in Cu/Sn/Ni micro-pillars
HY Yu, TH Yang, YS Chiu, CR Kao
Journal of Electronic Materials 49, 88-95, 2020
142020
Effects of aspect ratio on microstructural evolution of Ni/Sn/Ni microjoints
TH Yang, HY Yu, YW Wang, CR Kao
Journal of Electronic Materials 48, 9-16, 2019
142019
Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation
JJ Yu, JY Wu, LJ Yu, HW Yang, CR Kao
Journal of Materials Science 52, 7166-7174, 2017
112017
Self-powered broadband photodetection enabled by facile CVD-grown MoS 2/GaN heterostructures
BW Liang, WH Chang, CS Huang, YJ Huang, JH Chen, KS Li, ...
Nanoscale 15 (45), 18233-18240, 2023
102023
Organic-inorganic solid-state hybridization with high-strength and anti-hydrolysis interface
TH Yang, CR Kao, A Shigetou
Scientific Reports 9 (1), 504, 2019
102019
Foldable kirigami paper electronics
TH Yang, H Hida, D Ichige, J Mizuno, C Robert Kao, J Shintake
physica status solidi (a) 217 (9), 1900891, 2020
92020
Defect-engineered room temperature negative differential resistance in monolayer MoS 2 transistors
WH Chang, CI Lu, TH Yang, ST Yang, KB Simbulan, CP Lin, SH Hsieh, ...
Nanoscale Horizons 7 (12), 1533-1539, 2022
72022
Submicron memtransistors made from monocrystalline molybdenum disulfide
ST Yang, TH Yang, BW Liang, HC Lo, WH Chang, PY Lin, CY Su, YW Lan
ACS nano 18 (9), 6936-6945, 2024
62024
Sub-bandgap photoluminescence properties of multilayer h-BN-on-sapphire
S Saha, YC Chang, TH Yang, A Rice, A Ghosh, W You, M Crawford, ...
Nanotechnology 33 (21), 215702, 2022
62022
Room temperature negative differential resistance in clay-graphite paper transistors
ST Yang, TH Yang, CI Lu, WH Chang, KB Simbulan, YW Lan
Carbon 176, 440-445, 2021
52021
Polyimide-polyetheretherketone and tin-polyimide direct bonding via ethanol-assisted vacuum ultraviolet irradiation
TH Yang, YS Chiu, CY Yang, A Shigetou, CR Kao
Transactions of The Japan Institute of Electronics Packaging 12, E19-012-1 ¡K, 2019
52019
Critical factors affecting structural transformations in 3D IC micro joints
HW Yang, HY Yu, CR Kao
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1008-1013, 2017
52017
A single process for homogeneous and heterogeneous bonding in flexible electronics: Ethanol-assisted vacuum ultraviolet (E-VUV) irradiation process
TH Yang, CY Yang, A Shigetou, CR Kao
2019 International Conference on Electronics Packaging (ICEP), 117-122, 2019
42019
Morphological evolution induced by volume shrinkage in micro joints
HW Yang, CR Kao
2016 International Conference on Electronics Packaging (ICEP), 286-289, 2016
42016
Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation
TH Yang, CR Kao, A Shigetou
2018 International Conference on Electronics Packaging and iMAPS All Asia ¡K, 2018
32018
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Articles 1–20