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- Lane W. MartinRice UniversityVerified email at rice.edu
- Piush BeheraMaterials Science and Engineering, UC BerkeleyVerified email at berkeley.edu
- R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
- Rajiv DusaneInstitute Chair Professor in MEMS, Indian Institute of Technology BombayVerified email at iitb.ac.in
- Dr Ankur SoamIIT BombayVerified email at soa.ac.in
- Lucas CarettaAssistant Professor at Brown UniversityVerified email at brown.edu
- Po-Yao LinManager, Advanced Packaging Technology and Service, TSMCVerified email at tsmc.com
- Xiaoxi HuangUniversity of California, Berkeley, Cornell UniversityVerified email at berkeley.edu
- Hongrui ZhangUniversity of California, BerkeleyVerified email at berkeley.edu
- Eric ParsonnetPhysics PhD StudentVerified email at berkeley.edu
- James Analytisuniversity of california, berkeleyVerified email at berkeley.edu
- Hossein TaghinejadKavli ENSI Junior Fellow, UC BerkeleyVerified email at berkeley.edu
- Abel FernandezMaterials Science and Engineering, UC BerkeleyVerified email at berkeley.edu
- Peter MeisenheimerUniversity of California, BerkeleyVerified email at berkeley.edu
- Dr Laksheswar kalita, (PhD IIT Bomba...Applied materials Inc, Research SceientistVerified email at amat.com
- Lekha PeedikakkandyIndian Institute of Technology Bombay (IITB)Verified email at iitbombay.org
- Parag BhargavaIIT BombayVerified email at iitb.ac.in
- Rahul KumarUNSW, SydneyVerified email at unsw.edu.au
- Kaushik ParidaIndian Institute of Technology Roorkee (IIT Roorkee)Verified email at pe.iitr.ac.in
- Long-Qing ChenThe Pennslvania State UniversityVerified email at psu.edu