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Co-authors
- Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
- Gengchiau LiangNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw
- Yuan DONGInstitute of Microelectronics (IME, A*Star), and National University of Singapore (NUS)Verified email at u.nus.edu
- Genquan HanXidian UniversityVerified email at xidian.edu.cn
- Qian ZhouYee-Chia Yeo's Group, National University of SingaporeVerified email at nus.edu.sg
- Chuan Seng TanProfessor, Nanyang Technological University, Singapore | IEEE Fellow | IMAPS FellowVerified email at ntu.edu.sg
- Aaron TheanNational University of SingaporeVerified email at nus.edu.sg
- Kai NiUniversity of Notre DameVerified email at nd.edu
- Sachin Yadavimec, NUS, Niels Bohr InstituteVerified email at imec.be
- E A FitzgeraldCornell, ATT, MIT, Massachusetts Institute of Technology, NTUVerified email at mit.edu
- Bich-Yen NguyenSoitecVerified email at soitec.com
- Zhihong LiuXidian University, ChinaVerified email at xidian.edu.cn
- Xuanyao FongNational University of SingaporeVerified email at nus.edu.sg
- Charles LimJPMorgan Chase & CoVerified email at jpmorgan.com
- Sujith SubramanianIMECVerified email at imec.be
- Shinichi TakagiThe University of TokyoVerified email at ee.t.u-tokyo.ac.jp
- Krishna SaraswatProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Munho KimAssistant Professor of EEE at Nanyang Technological UniversityVerified email at ntu.edu.sg
- Aaron DannerNational University of SingaporeVerified email at nus.edu.sg