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- Yi CuiStanford UniversityVerified email at stanford.edu
- judy j. chaProfessor, Materials Science and Engineering, Cornell UniversityVerified email at cornell.edu
- Haotian WangRice UniversityVerified email at rice.edu
- Kristie J. KoskiUniversity of California DavisVerified email at ucdavis.edu
- Kai Yan(剡剀)Peking University (Ph. D.), Stanford University (PostDoc)Verified email at stanford.edu
- Po-Chun HsuThe University of ChicagoVerified email at uchicago.edu
- Hui WuTsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Wesley G ZhengStanford UniversityVerified email at nus.edu.sg
- Keji LaiUniversity of Texas at AustinVerified email at physics.utexas.edu
- Zhiyi LuNingbo Institute of Materials Technology&Engineering, CASVerified email at nimte.ac.cn
- Seung Sae HongUniversity of California, DavisVerified email at ucdavis.edu
- Liangbing HuUniversity of Maryland College ParkVerified email at umd.edu
- Hailin PengProfessor at Physical Chemistry, Peking UniversityVerified email at pku.edu.cn
- Zhi-xun ShenDepartment of Physics and Applied Physics, Stanford University, Stanford Institute for Materials andVerified email at stanford.edu
- Yulin Chen (陈宇林)Oxford University / ShanghaiTech UniversityVerified email at physics.ox.ac.uk
- Yao HongbinUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Zhenan BaoStanford UniversityVerified email at stanford.edu
- Vijay K NarasimhanDirector, R&D Collaborations, EMD ElectronicsVerified email at emdgroup.com
- Raphael PfattnerMaterials Science Institute of Barcelona, Spanish National Research Council (ICMAB-CSIC)Verified email at icmab.es
- Jiachen WangETH ZurichVerified email at ethz.ch
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DESHENG KONG
Professor, College of Engineering and Applied Sciences, Nanjing University
Verified email at nju.edu.cn - Homepage