Method of making semiconductor device using an interconnect J Leu, CD Thomas US Patent 6,605,874, 2003 | 355 | 2003 |
Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics J Leu, CI Wu, Y Zhou, GM Kloster US Patent 6,605,549, 2003 | 262 | 2003 |
Overview on low dielectric constant materials for IC applications PS Ho, J Leu, WW Lee Low Dielectric Constant Materials for IC Applications, 1-21, 2003 | 168 | 2003 |
Electromagnetically actuated micromachined flap CM Ho, DK Miu, JTS Leu, R Miller, A Desai, C Liu, T Tsao, YC Tai US Patent 5,629,918, 1997 | 152 | 1997 |
Low-K dielectric structure and method GM Kloster, X Morrow, J Leu US Patent 7,294,934, 2007 | 141 | 2007 |
Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide MD Goodner, J Leu US Patent 6,924,222, 2005 | 107 | 2005 |
Fracture of metal‐polymer line structures. I. Semiflexible polyimide SL Chiu, J Leu, PS Ho Journal of Applied Physics 76 (9), 5136-5142, 1994 | 96 | 1994 |
Thermoelectric properties of nanostructured bismuth–telluride thin films grown using pulsed laser deposition PH Le, CN Liao, CW Luo, J Leu Journal of alloys and compounds 615, 546-552, 2014 | 95 | 2014 |
Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements D Gan, PS Ho, R Huang, J Leu, J Maiz, T Scherban Journal of Applied Physics 97 (10), 2005 | 94 | 2005 |
Growth and characterization of topological insulator Bi2Se3 thin films on SrTiO3 using pulsed laser deposition PH Le, KH Wu, CW Luo, J Leu Thin Solid Films 534, 659-665, 2013 | 93 | 2013 |
Method for making a dual damascene interconnect using a multilayer hard mask P Morrow, J Leu, CH Jan US Patent 6,479,391, 2002 | 92 | 2002 |
Method of forming a selectively converted inter-layer dielectric using a porogen material GM Kloster, KP O'brien, MD Goodner, J Leu, DH Gracias, LD Rockford, ... US Patent 7,018,918, 2006 | 80 | 2006 |
Materials Issues and Characterization of Low-k Dielectric Materials ET Ryan, AJ McKerrow, J Leu, PS Ho Mrs Bulletin 22 (10), 49-54, 1997 | 80 | 1997 |
Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer G Kloster, J Leu, L Wong, A Ott, P Marrow US Patent 7,164,206, 2007 | 77 | 2007 |
Small angle x-ray scattering measurements of lithographic patterns with sidewall roughness from vertical standing waves C Wang, RL Jones, EK Lin, WL Wu, J Leu Applied Physics Letters 90 (19), 2007 | 75 | 2007 |
Dye-sensitized solar cells based on agarose gel electrolytes using allylimidazolium iodides and environmentally benign solvents HL Hsu, CF Tien, YT Yang, J Leu Electrochimica Acta 91, 208-213, 2013 | 69 | 2013 |
Fabrication and CO sensing properties of mesostructured ZnO gas sensors CY Liu, CF Chen, JP Leu Journal of The Electrochemical Society 156 (1), J16, 2008 | 63 | 2008 |
Out-of-plane magnetic actuators with electroplated permalloy for fluid dynamics control C Liu, T Tsao, GB Lee, JTS Leu, WY Yong, YC Tai, CM Ho Sensors and Actuators A: physical 78 (2-3), 190-197, 1999 | 61 | 1999 |
Effect of moisture on electrical properties and reliability of low dielectric constant materials YL Cheng, KW Leon, JF Huang, WY Chang, YM Chang, J Leu Microelectronic Engineering 114, 12-16, 2014 | 60 | 2014 |
Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material G Kloster, J Leu, HM Park US Patent 6,867,125, 2005 | 60 | 2005 |