| Improved theoretical solutions for adhesive lap joints MY Tsai, DW Oplinger, J Morton International Journal of Solids and structures 35 (12), 1163-1185, 1998 | 500 | 1998 |
| An evaluation of analytical and numerical solutions to the single-lap joint MY Tsai, J Morton International Journal of Solids and Structures 31 (18), 2537-2563, 1994 | 291 | 1994 |
| The effect of a spew fillet on adhesive stress distributions in laminated composite single-lap joints MY Tsai, J Morton Composite structures 32 (1-4), 123-131, 1995 | 276 | 1995 |
| An evaluation of the Iosipescu specimen for composite materials shear property measurement J Morton, H Ho, MY Tsai, GL Farley Journal of Composite Materials 26 (5), 708-750, 1992 | 160 | 1992 |
| Investigation of thermomechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling MY Tsai, CHJ Hsu, CTO Wang IEEE Transactions on Components and Packaging Technologies 27 (3), 568-576, 2004 | 128 | 2004 |
| A note on Suhir’s solution of thermal stresses for a die-substrate assembly MY Tsai, CH Hsu, CN Han J. Electron. Packag. 126 (1), 115-119, 2004 | 110 | 2004 |
| Experimental and numerical studies of a laminated composite single-lap adhesive joint MY Tsai, J Morton, FL Matthews Journal of Composite Materials 29 (9), 1254-1275, 1995 | 104 | 1995 |
| An investigation into the stresses in double-lap adhesive joints with laminated composite adherends MY Tsai, J Morton International Journal of Solids and Structures 47 (24), 3317-3325, 2010 | 102 | 2010 |
| Thermal measurements and analyses of low-cost high-power LED packages and their modules MY Tsai, CH Chen, CS Kang Microelectronics Reliability 52 (5), 845-854, 2012 | 98 | 2012 |
| Three-dimensional deformations in a single-lap joint MY Tsai, J Morton The Journal of Strain Analysis for Engineering Design 29 (2), 137-145, 1994 | 83 | 1994 |
| Warpage analysis of flip-chip PBGA packages subject to thermal loading MY Tsai, HY Chang, M Pecht IEEE Transactions on Device and Materials Reliability 9 (3), 419-424, 2009 | 82 | 2009 |
| An experimental investigation of nonlinear deformations in single-lap joints MY Tsai, J Morton Mechanics of materials 20 (3), 183-194, 1995 | 76 | 1995 |
| Numerical analysis of the Iosipescu specimen for composite materials H Ho, MY Tsai, J Morton, GL Farley Composites science and technology 46 (2), 115-128, 1993 | 74 | 1993 |
| The effect of epoxy molding compound on thermal/residual deformations and stresses in IC packages during manufacturing process MY Tsai, CT Wang, CH Hsu IEEE transactions on components and packaging technologies 29 (3), 625-635, 2006 | 57 | 2006 |
| An experimental investigation of losipescu specimen for composite materials H Ho, MY Tsai, J Morton, GL Farley Experimental Mechanics 31, 328-336, 1991 | 53 | 1991 |
| Evaluation of test methods for silicon die strength MY Tsai, CH Chen Microelectronics Reliability 48 (6), 933-941, 2008 | 50 | 2008 |
| Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain MY Tsai, YC Chen, SWR Lee IEEE Transactions on Components and Packaging Technologies 31 (3), 683-690, 2008 | 46 | 2008 |
| A note on peel stresses in single-lap adhesive joints MY Tsai, J Morton | 44 | 1994 |
| Stress and failure analysis of a pin-loaded composite plate: an experimental study MY Tsai, J Morton Journal of Composite Materials 24 (10), 1101-1120, 1990 | 44 | 1990 |
| Investigation on Cu TSV-induced KOZ in silicon chips: Simulations and experiments MY Tsai, PS Huang, CY Huang, H Jao, B Huang, B Wu, YY Lin, W Liao, ... IEEE Transactions on Electron Devices 60 (7), 2331-2337, 2013 | 42 | 2013 |
John MortonProfessor, Imperial College在 imperial.ac.uk 的電子郵件地址已通過驗證
